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  • JCET’s certificated Quality Test Center provides reliability tests, including environmental reliability tests, life reliability tests, and board level reliability tests; and a full range of failure analysis services.

    JCET has acquired the CNAS’s Accreditation. CNAS is a labs/testing organization accredited by China National Accreditation Service for Conformity Assessment.

    Reliability Test

    Items

    Standard

    Purpose

    Precondition (PRE)

    JESD22-A113

    To simulate the effects of changing circumstances including elevated temperatures and moisture during transportation, storage until board assembly. The test should be conducted prior to reliability testing.

    Moisture Sensitivity Level(MSL)

    IPC/JEDEC J-STD-020

    To identify the classification level of non-hermetic surface mount devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations.

    Temperature & Humidity Test
    (THT)

    GB/T2423.3 
    JESD22-A101

    To evaluate the ability of product to withstand stress of humidity and temperature for a long time.

    Temperature Cycling Test
    (TCT)

    JESD22-A104
    GB/T 2423.22

    To evaluate the ability of product to
    withstand alternating high- and low-temperature extremes.

    High Temperature Storage Test
    (HTST)

    GB/T 2423.2 
    JESD22-A103

    To evaluate the ability of product to withstand stress of high temperature for a long time.

    Low Temperature Storage Test
    (LTST)

    GB/T 2423.1 
    JESD22-A119 

    To evaluate the ability of product to withstand stress of low temperature for a long time.

    Pressure Cooker Test
    (PCT)

    JESD22-A102

    To evaluate the moisture resistance of package.

    Highly Accelerated
    Stress Test(u)HAST

    JESD22-A110 
    JESD22-A118

    To evaluate the moisture resistance of non-hermetic packaged devices under/without bias.

    Reflow

    JESD22-A113

    To assess thermal resistance and effect produced in reflow soldering process.

    BURN-IN 

    GB/T 4587

    To access device’s ability of bearing electric stress (voltage and current) and temperature stress (products temperature rise due to loading) for a long time.

    High Temperature Reverse Bias  
    (HTRB)

    GB/T 4587
    JESD22-A108 

    To determine the effects of bias conditions and temperature on solid state devices over time.

    Soldering Heat Test
    (SHT)

    GB/T 2423.28 
    JESD22-B106 

    To determine whether solid-state devices can withstand the effect of the temperature shock during soldering.

    Solderability

    GB/T 2423.28 
    EIA/IPC/JEDEC J-STD-002 

    To evaluate the solderability of product.

    Tin Whisker Test JESD201 
    JESD22-A121
    To assess the tin whisker growth situation of products under temperature and humidity stress for long time.
    Electrical Test GB/T 4589.1 
    GB/T 4587 
    GB/T 4586 
    GB/T 4023 
    GB/T 6571
    To evaluate the product electrical capacity. Mainly aimed at discrete device.

    Failure Analysis

    Items

    Standard

    Application

    Optical Microscope

     

    To inspect sample appearance, die surface, crack, contamination, scratch and oxide layer defects, etc.

    X-RAY

     

    To inspect bonding wires, attached die, and lead frame and void, etc.

    *SAT

    JEDEC J-STD-035-1999

    To inspect delamination, package crack, die crack, void in resin and bonding layer between die and pad, etc.

    Juno Test

     

    To test parameters of semiconductors, including diode, transistor, MOS, and three-terminal regulator.

    *Iv Curve Tracer

    GB/T 13973-2012

    To test parameters of semiconductors and ICs, including MOS and BJT, compared with good unit to find differences.

    TDR

     

    To measure reflections and time delays of pulses injected into a transmission line. Failure location, impedance measurement, and open/short test.

    De-Cap

     

    To remove the compound to expose the die and observe defects of die and bonding wire.  

    Probe Test

     

    To measure electrical parameter or characteristic curve of the die

    Crater Test

     

    To remove the top metal layer on pad and to observe the underlay damage

    Ion Milling System

     

    To do ion milling polishing to inspect tiny cracks, void, and multilayer structure interface.

    SEM

     

    To observe the surface and cross section of sample’s microstructure and measure the dimension of critical layer with high meg microscope.

    EDX

     

    To conduct qualitative and semi-quantitative element analysis for specified microstructure on the sample surface.

    RIE

     

    To inspect defects layer by layer, including etching residue, metal crack, metal damage, oxide defect, and poor via connection.

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